Low Pressure Overmoulding NEW 2018-04-16T10:13:50+00:00

Low Pressure Overmoulding

Low Pressure Overmoulding is an innovative encapsulation process positioned between traditional potting and injection moulding technologies. As a leading electronics manufacturing services provider, we offer a quality overmoulding solution for even the most complex projects.

With our quality low pressure overmoulding service you can protect your PCB and cable assemblies with a unbreakable, shock-proof solution.

What is it?

Low Pressure Overmoulding is an injection process whereby a PCB assembly, for example, is placed in a specially manufactured aluminium mould tool and completely surrounded (overmoulded) with a liquid compound that effectively forms the protection for the device. Low Pressure Overmoulding is a complimentary technology, it does not replace all potting applications and typically does not compete with traditional injection moulding.

This process greatly simplifies the production of final packaging and offers a technically efficient and cost-effective method.

What are the benefits?

  • It encapsulates and protects PCB and cable assemblies
  • Provides a rugged, almost unbreakable protection that is resistant to shock
  • It is an effective strain relief
  • There is the option to mould company logos or part number for an attractive look
  • Low Pressure Overmoulding is tamperproof and environmentally sealed

  • Unlike potting, it eliminates the need for housing
  • There is very little waste

How does it work?

The moulding compounds used are called ‘hot-melts‘ and are typically polyamide materials that are heated to 210C, forming a low viscosity material that can be injected at low pressure (typically 50 – 200 psi) into the mould cavity to encapsulate the electronics.

The injected material starts cooling as soon as it comes into contact with the mould cavity, thereby producing a short curing time cycle. The excellent adhesive properties forms a watertight seal (IP 67 rated) around the PCB without any chemical reaction, ensuring that no toxic fumes are produced. It is the low injection pressure that is paramount in preventing damage to the electronics and unlike traditional potting applications, there is no need for a separate housing.

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Montage Overmoulding
Low pressure overmoulding
Overmoulding

Why EC Electronics?

The use of specialist raw materials and mould equipment form the key elements in the low pressure overmoulding process. With the latest technology and over 30 years of experience, we guarantee excellence and quality for your project.

We work with some of the largest companies on some of the most interesting electronics projects. Our electronics manufacturing experts will not use their vast array of knowledge to provide an exceptional service, but we will also work with you to create a quality product designed for manufacturability.

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