Surface Mount and Through Hole
Extensive ESD protected Printed Circuit Board assembly facilities available at our factory sites in the UK and Romania enables us to meet the most demanding applications for both Surface Mount and Plated Through Hole Technologies.
Our manufacturing sites are equipped with state of the art convection reflow and wave soldering equipment to ensure controlled soldering of PCB components following automatic or hand placement.
Our high speed pick and place lines are configured with LCS ( large component sequencers), state of the art solder paste printers and convection reflow solder ovens. Components can be placed ranging from 0201 up to 32mm square PLCC and QFP’s. BGA’s, uBGA’s and CSP’s can be placed with ball pitches down to 0.75mm and ball diameters down to 0.3mm.
Automated Optical Inspection ( AOI ) is provided as standard practice to provide a fast, responsive and flexible QA environment.
Fully trained operators assemble the widest range of highly complex boards to Industry Standard IPC-A-610D Class 3.