Low Pressure Moulding 2017-08-25T12:19:31+00:00
EC Electronics

Low Pressure Moulding

Encapsulation and Protection

Low Pressure Overmoulding (LPO) encapsulates and protects of PCB & Cable Assemblies.

It is an innovative encapsulation process positioned between traditional potting and injection moulding technologies. It is a complimentary technology. It does not replace all potting applications and typically doesn‘t compete with traditional injection moulding.

LPO is an injection process whereby a PCB assembly, for example, is placed in a specially manufactured aluminium mould tool, and completely surrounded (overmoulded) with a liquid compound that effectively forms the housing for the device.

There are many benefits of Low Pressure Overmoulding:

 Rugged, almost unbreakable protection – resistance to shock

 Effective strain relief

 Attractive – Option to mould company logos or part numbers

 Tamperproof and environmentally sealed

 Eliminates the need for housing as required in potting

 Very little waste

 No toxic fumes – an environmentally friendly process

Our Overmoulding Service Capabilities and Benefits:

 Design to delivery of custom made PCB and Cable Assemblies

 3D CAD design facility for Tooling design and manufacture in the UK

 Consultancy and advice on materials and equipment

 Quality assurance and testing

 Low cost manufacture of assemblies in Romania

 Excellent support and outstanding service.

Low Pressure Overmoulding
Montage Overmoulding
Montage Overmoulding 2