Low Pressure Moulding
Encapsulation and Protection
Low Pressure Overmoulding (LPO) encapsulates and protects of PCB & Cable Assemblies.
It is an innovative encapsulation process positioned between traditional potting and injection moulding technologies. It is a complimentary technology. It does not replace all potting applications and typically doesn‘t compete with traditional injection moulding.
LPO is an injection process whereby a PCB assembly, for example, is placed in a specially manufactured aluminium mould tool, and completely surrounded (overmoulded) with a liquid compound that effectively forms the housing for the device.
There are many benefits of Low Pressure Overmoulding:
Rugged, almost unbreakable protection – resistance to shock
Effective strain relief
Attractive – Option to mould company logos or part numbers
Tamperproof and environmentally sealed
Eliminates the need for housing as required in potting
Very little waste
No toxic fumes – an environmentally friendly process
Our Overmoulding Service Capabilities and Benefits:
Design to delivery of custom made PCB and Cable Assemblies
3D CAD design facility for Tooling design and manufacture in the UK
Consultancy and advice on materials and equipment
Quality assurance and testing
Low cost manufacture of assemblies in Romania
Excellent support and outstanding service.