How can air bubbles be avoided in the final moulded part?

Ensuring that the mould-set is vented correctly and optimising the injection profile is the key to avoiding air bubbles.

Densely populated circuit boards may require several steps in the injection profile to avoid any “shadow effects” behind components.

We would typically start by optimising flow with translucent materials to detect where voids occur and then change to black materials for production.

2017-05-22T15:47:05+00:00 May 22nd, 2017|