E346021       UK      |    Romania    |   Hong Kong   + 44 ( 0 ) 1256 461894 Copyright EC Electronics Limited 2010 News September 2009 EC installs high speed YEStech F1S AOI  system.  • Quick Set Up • High Defect Coverage • High Speed • Low False Failure Rate 23rd September 2009 YESTech's advanced Thin Camera™ technology offers high-speed PCB inspection with exceptional defect coverage. With up top-down viewing cameras and four side viewing cameras, the F1-Series inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput. Programming the F-Series is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The F1-Series utilizes a standard package library to simplify training and insure program portability across manufacturing lines. Newly available image processing technology integrates several techniques, including colour, normalized correlation and rule-based algorithms, to provide complete inspection coverage with an extremely low false failure rate. Configurable for all line positions, the F1-Series is equally effective for paste, pre / post-reflow or final assembly inspection. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution. Bill Green, EC's Sales Director comments: ' We chose the YEStech F1S system over others reviewed because it offers high speed and a high level of functionality with it's 4 side viewing cameras as well as the single top down camera. The new system will further enhance our commitment to providing our customers with a high quality service as well as improving the internal yield within our SMT PCB assembly department.' To obtain a quotation for the manufacture of your products please click here Home I About Us I Industries I Services I News I Careers I How to find us I Contact Us I Privacy Statement I